Semiconductor light-emitting device

ABSTRACT

A semiconductor light-emitting device includes a substrate, a first reflective layer disposed on the substrate and including first openings, a first conductivity-type semiconductor layer grown in and extending from the first openings and connected on the first reflective layer, a second reflective layer disposed on the first conductivity-type semiconductor layer and including second openings having lower surfaces disposed to be spaced apart from upper surfaces of the first openings, and a plurality of light-emitting nanostructures including nanocores extending from the second openings and formed of a first conductivity-type semiconductor material, and active layers and second conductivity-type semiconductor layers sequentially disposed on the nanocores.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a divisional application based on pending application Ser. No.14/662,149, filed Mar. 18, 2015, the entire contents of which is herebyincorporated by reference.

This application claims priority under 35 U.S.C. § 119 to Korean PatentApplication No. 10-2014-0110660 filed on Aug. 25, 2014, with the KoreanIntellectual Property Office, the disclosure of which is incorporatedherein by reference.

BACKGROUND

The present disclosure relates to a semiconductor light-emitting device.

A semiconductor light-emitting device emits light through thecombination of electrons and holes injected in a compound semiconductoractive layer. However, when dislocations exist in such a semiconductorlight-emitting device, electrons and holes may combine in thedislocations, thermal energy rather than light energy may be mainlyconverted from electric energy, and thus light extraction efficiency ofthe semiconductor light-emitting device may be reduced. Accordingly,various technologies for reducing dislocations and improving lightextraction efficiency may be required.

SUMMARY

An aspect of the present disclosure may provide a semiconductorlight-emitting device having improved light extraction efficiency.

According to an aspect of the present disclosure, a semiconductorlight-emitting device includes a substrate, a first reflective layerdisposed on the substrate and including first openings, a firstconductivity-type semiconductor layer grown in and extending from thefirst openings and connected on the first reflective layer, a secondreflective layer disposed on the first conductivity-type semiconductorlayer and including second openings having lower surfaces disposed to bespaced apart from upper surfaces of the first openings, and a pluralityof light-emitting nanostructures including nanocores extending from thesecond openings and formed of a first conductivity-type semiconductormaterial, and active layers and second conductivity-type semiconductorlayers sequentially disposed on the nanocores.

In some exemplary embodiments, the first reflective layer may include apillar-shaped distributed Bragg reflector extending perpendicular to thesubstrate, and the distributed Bragg reflector may be surrounded by thefirst openings, and the distributed Bragg reflector is surrounded by thefirst openings.

In other exemplary embodiments, the first openings may have a pillarshape extending perpendicular to the substrate, and the first reflectivelayer may include a distributed Bragg reflector surrounding the firstopenings.

Here, areas of the upper surfaces of the first openings may be greaterthan areas of the lower surfaces of the second openings.

In other exemplary embodiments, the first openings may have a pillarshape having a lateral surface angled with respect to an upper surfaceof the substrate, and the first reflective layer may include adistributed Bragg reflector surrounding the first openings.

In other exemplary embodiments, the second reflective layer may includea distributed Bragg reflector surrounding the second openings.

In other exemplary embodiments, the semiconductor light-emitting devicemay further include a third reflective layer disposed below the firstreflective layer, wherein the third reflective layer includes thirdopenings having upper surfaces disposed to be spaced apart from lowersurfaces of the first openings, and a first conductivity-typesemiconductor bottom layer grown in and extending from the thirdopenings and connected on the third reflective layer.

In other exemplary embodiments, the semiconductor light-emitting devicemay further include a buffer layer disposed on the substrate.

In other exemplary embodiments, the semiconductor light-emitting devicemay further include a first electrode disposed on the firstconductivity-type semiconductor layer.

In other exemplary embodiments, the semiconductor light-emitting devicemay further include a contact electrode layer disposed on the pluralityof light-emitting nanostructures and the second reflective layer.

In other exemplary embodiments, a thickness of a portion of the firstconductivity-type semiconductor layer formed on the first reflectivelayer may be less than that of the first reflective layer.

In other exemplary embodiments, the substrate may be silicon (Si)substrate.

According to another aspect of the present disclosure, a semiconductorlight-emitting device includes a substrate, a first reflective layerdisposed on the substrate, wherein the second reflective layer includesfirst openings, a first conductivity-type semiconductor lower layergrown in and extending from the first openings and connected on thefirst reflective layer, a second reflective layer disposed on the firstconductivity-type semiconductor lower layer, wherein the secondreflective layer includes second openings having lower surfaces disposedto be spaced apart from upper surfaces of the first openings, a firstconductivity-type semiconductor upper layer grown in and extending fromthe second openings and connected on the second reflective layer, and anactive layer and a second conductivity-type semiconductor layersequentially disposed on the first conductivity-type semiconductor upperlayer.

In other exemplary embodiments, the second reflective layer includes apillar-shaped distributed Bragg reflector having a lateral surfaceangled with respect to an upper surface of the substrate, and thedistributed Bragg reflector is surrounded by the second openings.

In other exemplary embodiments, the second openings have pillar shapehaving a lateral surface angled with respect to the upper surface of thesubstrate, and the second reflective layer includes a distributed Braggreflector surrounding the second openings.

In other exemplary embodiments, the first reflective layer may includetrench-shaped first openings extending in one direction and bar-shapeddistributed Bragg reflectors disposed alternately with the firstopenings, and the second reflective layer may include trench-shapedsecond openings extending in one direction and bar-shaped distributedBragg reflectors disposed alternately with the second openings.

According to another aspect of the present disclosure, a semiconductorlight-emitting device may include a substrate, a second reflective layerincluding a second pattern and a second opening penetrating through thesecond reflective layer, a light-emitting structure including a firstlayer formed of a first conductivity-type semiconductor material, asecond conductivity-type semiconductor layer, and an active layerinterposed between the first layer and the second conductivity-typesemiconductor layer, a first reflective layer interposed between thelight-emitting structure and the substrate and including a first patternand a first opening penetrating through the first reflective layer, anda first conductivity-type semiconductor layer including a first portionfilling the first opening and a second portion interposed between thefirst pattern and the second opening. A portion of the first layer mayfill the second opening.

In other exemplary embodiments, the first and second openings may notoverlap with each other.

In other exemplary embodiments, the substrate may be silicon (Si)substrate.

In other exemplary embodiments, the first reflective layer may include adistributed Bragg reflector.

In other exemplary embodiments, the second reflective layer may includea distributed Bragg reflector.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features and other advantages of thepresent disclosure will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a cross-sectional view of a semiconductor light-emittingdevice according to an exemplary embodiment of the present disclosure;

FIGS. 2 to 11 are process views illustrating a method of fabricating thesemiconductor light-emitting device according to an exemplary embodimentof the present disclosure.

FIG. 12 is a plan view of a semiconductor light-emitting deviceaccording to an exemplary embodiment of the present disclosure;

FIG. 13 is a plan view of a semiconductor light-emitting deviceaccording to an exemplary embodiment of the present disclosure;

FIG. 14 is a cross-sectional view of a semiconductor light-emittingdevice according to an exemplary embodiment of the present disclosure;

FIG. 15A is an exploded perspective view illustrating a first reflectivelayer and a second reflective layer of a semiconductor light-emittingdevice according to an exemplary embodiment of the present disclosure;

FIG. 15B is an exploded perspective view illustrating a first reflectivelayer and a second reflective layer of a semiconductor light-emittingdevice according to an exemplary embodiment of the present disclosure;

FIG. 15C is an exploded perspective view illustrating a first reflectivelayer and a second reflective layer of a semiconductor light-emittingdevice according to an exemplary embodiment of the present disclosure;

FIG. 15D is an exploded perspective view illustrating a first reflectivelayer and a second reflective layer of a semiconductor light-emittingdevice according to an exemplary embodiment of the present disclosure;

FIG. 15E is an exploded perspective view illustrating a first reflectivelayer and a second reflective layer of a semiconductor light-emittingdevice according to an exemplary embodiment of the present disclosure;

FIG. 16 illustrates a semiconductor light-emitting device according toan exemplary embodiment of the present disclosure;

FIG. 17 illustrates a semiconductor light-emitting device according toan exemplary embodiment of the present disclosure;

FIGS. 18 and 19 are cross-sectional views illustrating a semiconductorlight-emitting device package according to an exemplary embodiment ofthe present disclosure;

FIGS. 20 and 21 illustrate examples of a backlight unit including ananostructure semiconductor light-emitting device according to anexemplary embodiment of the present disclosure;

FIG. 22 illustrates an example of an illumination apparatus including ananostructure semiconductor light-emitting device according to anexemplary embodiment of the present disclosure; and

FIG. 23 illustrates an example of a headlamp including a nanostructuresemiconductor light-emitting device according to an exemplary embodimentof the present disclosure.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be described indetail with reference to the accompanying drawings.

The disclosure may, however, be exemplified in many different forms andshould not be construed as being limited to the specific embodiments setforth herein. Rather, these embodiments are provided so that thisdisclosure will be thorough and complete, and will fully convey thescope of the disclosure to those skilled in the art. In the drawings,the shapes and dimensions of elements may be exaggerated for clarity,and the same reference numerals will be used throughout to designate thesame or like elements.

Reference throughout this disclosure to “one exemplary embodiment” or“an exemplary embodiment” is provided to emphasize a particular feature,structure, or characteristic, and do not necessarily refer to the sameembodiment. Furthermore, the particular features, structures, orcharacteristics may be combined in any suitable manner in one or moreembodiments. For example, a context described in a specific exemplaryembodiment may be used in other embodiments, even if it is not describedin the other embodiments, unless it is described contrary to orinconsistent with the context in the other embodiments.

Unless described otherwise, throughout this disclosure, terms such as“on,” “upper surface,” “below,” “lower surface,” “upward,” “downward,”“side surface,” “high,” and “low” may be relative terms based on thedrawings, and may vary, depending on a direction in which alight-emitting device is disposed. Further, it will be understood thatwhen a layer is referred to as being “on” or “below” another layer or asubstrate, the layer may be formed directly on the other layer or thesubstrate, or an intervening layer may exist between the layer and theother layer or the substrate.

FIG. 1 is a cross-sectional view illustrating a semiconductorlight-emitting device according to an exemplary embodiment of thepresent disclosure.

Referring to FIG. 1, a semiconductor light-emitting device 100 mayinclude a substrate 110, a buffer layer 120 disposed on the substrate110, a first reflective layer 130 disposed on the buffer layer 120 andincluding first openings O1, a first conductivity-type semiconductorlayer 140 grown in and extending from the first openings O1 andconnected on the first reflective layer 130, a second reflective layer132 disposed on the first conductivity-type semiconductor layer 140 andincluding second openings O2 having lower surfaces disposed to be spacedapart from upper surfaces of the first openings O1, a plurality oflight-emitting nanostructures 150 including nanocores 152 grown in andextending from the second openings O2 and formed of a firstconductivity-type semiconductor material, and active layers 154 andsecond conductivity-type semiconductor layers 156 sequentially disposedon the nanocores 152, a contact electrode layer 160 disposed on thesecond reflective layer 132 and the plurality of light-emittingnanostructures 150, a second electrode 170 disposed on a portion of thecontact electrode layer 160, and a first electrode 172 disposed on anexposed portion of an upper surface of the first conductivity-typesemiconductor layer 140. The exposed portion of the upper surface of thefirst conductivity-type semiconductor layer 140 may be formed byremoving one side of the semiconductor light-emitting device 100.

The substrate 110 may be provided as a growth substrate for asemiconductor layer. The substrate 110 may be formed of an insulating,conductive, or semiconductor material. Meanwhile, as a material for thegrowth substrate, silicon (Si) may be used. Since a Si substrate isappropriate for obtaining a large diameter and has relatively lowmanufacturing costs, mass productivity of semiconductor light-emittingdevices may be improved. In addition, since the Si substrate hasconductivity, an electrode may be formed on a lower surface of the Sisubstrate. Further, since the Si substrate has a higher thermalconductivity than a sapphire substrate, warpage thereof may not beincreased at high temperature.

The buffer layer 120 disposed on the substrate 110 may function toreduce dislocations generated while a semiconductor layer is grown onthe substrate 110, and prevent light generated by a light-emitting layerfrom being absorbed by the substrate 110. When the Si substrate is used,the buffer layer 120 may be formed of a material having smalldifferences in thermal expansion coefficient and lattice constant fromthe Si substrate. For example, the buffer layer 120 may be one selectedfrom a group consisting of AlN, AlGaN, InGaN, and GaN.

The first reflective layer 130 including the first openings O1 may bedisposed on the buffer layer 120. The first openings O1 may refer toempty spaces between patterns 130P in the patterned first reflectivelayer 130, prior to forming other layers, such as the firstconductivity-type semiconductor layer 140. The first openings O1 may beformed to have a size in the range of several to several tens ofmicrometers, for example, a diameter in the range of about 1 μm to about10 μm.

The patterns 130P of the first reflective layer 130 may be a distributedBragg reflector. In addition, the patterns 130P of the first reflectivelayer 130 may be an omni-directional reflector (ODR).

The distributed Bragg reflector is a multilayer structured reflector inwhich materials having different refractive indices are periodicallylayered. For example, the distributed Bragg reflector may have astructure in which first and second dielectric layers 133 and 134 havingdifferent refractive indices are alternately deposited. Each of thefirst and second dielectric layers 133 and 134 may be an oxide ornitride of an element selected from the group consisting of Si, Zr, Ta,Ti, and Al. More specifically, each of the first and second dielectriclayers 133 and 134 may be formed of at least one material among SiO₂,Si₃N₄, SiON, TiO₂, Al₂O₃, and ZrO. A refractive index of SiO₂ is 1.46, arefractive index of Si₃N₄ is 2.05, a refractive index of SiON is1.46˜2.05, a refractive index of TiO₂ is 2.49˜2.90, a refractive indexof Al₂O₃ is 1.77, and a refractive index of ZrO is 1.90.

When a wavelength of light generated by a light-emitting layer is λ, andn1 and n2 are refractive indices of the first and second dielectriclayers 133 and 134, respectively, thicknesses d1 and d2 of the first andsecond dielectric layers 133 and 134 may be represented by the followingEquation 1,

$\begin{matrix}{{{d\; 1} = \frac{( {{2\; p} - 1} ) \times \lambda}{4 \times n\; 1}}{{d\; 2} = \frac{( {{2\; q} - 1} ) \times \lambda}{4 \times n\; 2}}} & \lbrack {{Equation}\mspace{14mu} 1} \rbrack\end{matrix}$

wherein p and q are integers of 1 or more.

More specifically, the thicknesses of the first and second dielectriclayers 133 and 134 may be in the range of about 300 Å to about 900 Å.

The distributed Bragg reflector including the first and seconddielectric layers 133 and 134 having such thicknesses and reflectiveindices may show high reflectivity of 95% or more.

A first conductivity-type semiconductor material may be grown in andextend from the first openings O1 disposed between the patterns 130P ofthe first reflective layer 130 and extend onto the first reflectivelayer 130 to be connected on the first reflective layer 130. That is,the first conductivity-type semiconductor material may be subjected toepitaxial lateral overgrowth (ELO) using the distributed Braggreflector, that is, the patterns 130P, as a mask to form the firstconductivity-type semiconductor layer 140. In FIG. 1, the firstconductivity-type semiconductor material grown from the first openingsO1, and the first conductivity-type semiconductor material connected onthe first reflective layer 130 are divided and marked by a dotted linein the first conductivity-type semiconductor layer 140.

The reason for forming the first conductivity-type semiconductor layer140 by the ELO method using the distributed Bragg reflector includingthe first openings O1 is that when the first conductivity-typesemiconductor material is a group-III nitride-based semiconductormaterial, it is difficult to grow a crystalline thin-film of thegroup-III nitride-based semiconductor material on the distributed Braggreflector.

The first conductivity-type semiconductor material forming the firstconductivity-type semiconductor layer 140 may be, for example, anitride-based semiconductor material satisfying Al_(x)In_(y)Ga_(1-x-y)N(0≤x≤1, 0≤y≤1, and 0≤x+y≤1) doped with n-type impurities.

The second reflective layer 132 including the second openings O2 havingthe lower surfaces disposed to be spaced apart from the upper surfacesof the first openings O1 may be formed on the first conductivity-typesemiconductor layer 140. The second openings O2 may refer to emptyspaces between patterns 132P of the patterned second reflective layer132, prior to forming other layers, such as the nanocores 152. Thesecond openings O2 may be formed to have a size in the range of severalto several tens of micrometers, for example, a diameter in the range ofabout 1 μm to about 10 μm.

The patterns 132P of the second reflective layer 132 may be adistributed Bragg reflector. In addition, the patterns 132P of thesecond reflective layer 132 may be an omni-directional reflector (ODR).The patterns 132P of the second reflective layer 132 may have the samestructure and the same material as the patterns 130P of the firstreflective layer 130.

A first conductivity-type semiconductor material may be grown in andextend from the second openings O2 to be nanocores 152. The firstconductivity-type semiconductor material forming the nanocores 152 maybe the same as the material forming the first conductivity-typesemiconductor layer 140.

Depending on the size of the second openings O2, diameters, lengths,positions, and growth conditions of the nanocores 152 may be determined.The second openings O2 may have a variety of shapes, such as a circle, arectangle, or a hexagon.

The active layers 154 and the second conductivity-type semiconductorlayers 156 may be sequentially grown on surfaces of the nanocores 152 toform light-emitting nanostructures 150 having core-shell structures.Each light-emitting nanostructure 150 may include a pillar-shaped bodyand an upper end portion disposed on the body. Side surfaces of the bodyof the light-emitting nanostructures 150 may have the same crystalplane, and the upper end portions of the light-emitting nanostructures150 may have a different crystal plane from the side surfaces of thelight-emitting nanostructures 150. For example, when a growth surface ofthe first conductivity-type semiconductor layer 140 exposed by thesecond openings O2 is a c-plane, the side surfaces of the body portionsof the light-emitting nanostructures 150 may be a nonpolar plane (m),and surfaces of the upper end portions of the light-emittingnanostructures 150 may be a semipolar plane (r).

The active layers 154 disposed on the surface of the nanocores 152 mayhave a multiple quantum well (MQW) structure in which quantum welllayers and quantum barrier layers are alternately stacked, or a singlequantum well (SQW) structure. For example, the active layers 154 may beformed of a GaN-based group III-V nitride semiconductor material. Morespecifically, the active layers 154 may have a MQW or SQW structureformed of InGaN/GaN, InGaN/InGaN, InGaN/AlGaN, or InGaN/InAlGaN.

A second conductivity-type semiconductor material forming the secondconductivity-type semiconductor layers 156 disposed on the active layers154 may be, for example, a nitride semiconductor material doped withp-type impurities and satisfying Al_(x)In_(y)Ga_(1-x-y)N (0≤x≤1, 0≤y≤1,and 0≤x+y≤1).

The contact electrode layer 160 may be disposed on the secondconductivity-type semiconductor layers 156 and the patterns 132P of thesecond reflective layer 132. The contact electrode layer 160 may be oneof a transparent conductive oxide layer or a nitride layer so that lightemitted by the light-emitting nanostructures 150 passes through thecontact electrode layer 160. The transparent conductive contactelectrode layer 160 may be, for example, at least one selected from thegroup consisting of, indium tin oxide (ITO), zinc-doped indium tin oxide(ZITO), zinc indium oxide (ZIO), gallium indium oxide (GIO), zinc tinoxide (ZTO), fluorine-doped tin oxide (FTO), aluminum-doped zinc oxide(AZO), gallium-doped zinc oxide (GZO), In₄Sn₃O₁₂, and zinc magnesiumoxide (Zn_((1-x))Mg_(x)O, 0≤x≤1). As necessary, the contact electrodelayer 160 may include graphene.

The first and second electrodes 172 and 170 may be formed to apply powerso that electrons and holes are combined in the active layers 154. Thesecond electrode layer 170 may be disposed on a portion of the contactelectrode layer 160. One side of the second reflective layer 132 may beremoved to expose a portion of the first conductivity-type semiconductorlayer 140, and then the first electrode layer 172 may be disposed on theexposed portion of the first conductivity-type semiconductor layer 140.

Although two reflective layers are stacked in the embodiment of FIG. 1,three or more reflective layers may be stacked in other embodiments (notshown) of the present disclosure, as necessary. For example, when thethree reflective layers are stacked, a third reflective layer includingthird openings may be disposed below the first reflective layer 130 inthe embodiment of FIG. 1, and upper surfaces of the third openings maybe disposed to be spaced apart from lower surfaces of the first openingsO1 of the first reflective layer 130 of FIG. 1. In addition, a bottomlayer formed of a first conductivity-type semiconductor material grownin and extending from the third openings and connected on the thirdreflective layer may be further included.

FIGS. 2 to 11 are process views illustrating each process of a method offabricating the semiconductor light-emitting device 100 illustrated inFIG. 1.

Referring to FIG. 2, a buffer layer 120 may be formed on a substrate110, and a first planar reflective layer 130′ may be formed on thebuffer layer 120. The first planar reflective layer 130′ may be, forexample, a distributed Bragg reflector in which first and second planardielectric thin-films 133′ and 134′ having different refractive indicesare alternately stacked and openings are not yet formed therein. Amethod of growing the buffer layer 120 and the first planar reflectivelayer 130′ may be, for example, metal organic chemical vapor deposition(MOCVD), hydride vapor phase epitaxy (HVPE), or molecular beam epitaxy(MBE).

Next, referring to FIG. 3A, portions of the first planar reflectivelayer 130′ in FIG. 2 may be removed to form first openings O1 exposingthe buffer layer 120. The first openings O1 may be formed by, forexample, a dry etching process. More specifically, the first openings O1may be formed by performing plasma etching using a combination of CF₄,C₂F₆, C₃F₈, C₄F₈, or CHF₃ with at least one of O₂ and Ar. Through theformation of the first openings O1, patterns 130P of the patterned firstreflective layer 130 may be formed.

FIG. 3B is a perspective view illustrating a process described withreference to FIG. 3A.

Referring to FIG. 3B, a buffer layer 120 may be formed on the substrate110, and a first reflective layer 130 may be formed on the buffer layer120. Here, the patterns 130P of the patterned first reflective layer 130may be a pillar-shaped distributed Bragg reflector extendingperpendicular to the substrate 110. In addition, the patterns 130P mayhave a polygonal columnar shape having various cross-sectional shapes.The first openings O1 surrounding the patterns 130P may be formedbetween the patterns 130P.

FIG. 3C is a perspective view illustrating a process described withreference to FIG. 3A according to another embodiment of the presentinvention.

Referring to FIG. 3C, a buffer layer 120 a may be formed on a substrate110 a, and a first reflective layer 130 a may be formed on the bufferlayer 120 a. Here, the first reflective layer 130 a may includepillar-shaped first openings O1 a extending perpendicular to thesubstrate 110 a. In addition, the first openings O1 a may have apolygonal columnar shape having various cross-sectional shapes. Thefirst reflective layer 130 a may be a distributed Bragg reflector.

FIG. 3D is a perspective view illustrating a process described withreference to FIG. 3A according to another embodiment of the presentinvention.

Referring to FIG. 3D, a buffer layer 120 b may be formed on a substrate110 b, and a first reflective layer 130 b may be formed on the bufferlayer 120 b. Here, the first reflective layer 130 b may includedome-shaped first openings O1 b whose upper surfaces are planar.

Next to FIG. 3A, referring to FIG. 4, after the substrate 110, thebuffer layer 120, and the first reflective layer 130 are formed, a firstconductivity-type semiconductor material may be grown in and extendbetween the patterns 130P of the first reflective layer 130 to beconnected on the first reflective layer 130, to form a firstconductivity-type semiconductor material layer 144.

Next, referring to FIG. 5, an upper surface of the firstconductivity-type semiconductor material layer 144 grown between thepatterns 130P of the first reflective layer 130 disposed on thesubstrate 110 and the buffer layer 120 and connected on the firstreflective layer 130 in FIG. 4 may be polished to form a firstconductivity-type semiconductor layer 140 having a planar upper surface.The polishing may be performed using chemical mechanical polishing(CMP), for example. The upper portions of the first conductivity-typesemiconductor layer 140, connected on the first reflective layer 130,may be formed to be thin since light emitted from a light-emitting layeris totally reflected on the portions and leaked through side surfaces ofthe portions when the portion is thick. More specifically, a thicknessof the portions, connected on the first reflective layer 130, of thefirst conductivity-type semiconductor layer 140 may be less than that ofthe first reflective layer 130.

Next, referring to FIG. 6, a second planar reflective layer 132′ may beformed on the substrate 110, the buffer layer 120, the first reflectivelayer 130 including the patterns 130P, and the first conductivity-typesemiconductor layer 140. The second planar reflective layer 132′ may be,for example, a distributed Bragg reflector in which first and secondplanar dielectric thin-films 136 and 138 having different refractiveindices are alternately stacked, and openings are not formed thereonyet. A method of growing the second planar reflective layer 132′ may bethe same as the method of growing the first planar reflective layer130′.

Next, referring to FIG. 7, a mask layer 145 may be formed on thesubstrate 110, the buffer layer 120, the first reflective layer 130including the patterns 130P, the first conductivity-type semiconductorlayer 140, and the second planar reflective layer 132′ of FIG. 6. Then,the mask layer 145 and the second planar reflective layer 132′ may beetched to expose the first conductivity-type semiconductor layer 140 andform second openings O2.

Here, upper surfaces of the first openings O1 in FIG. 3A and lowersurfaces of the second openings O2 may be disposed to be spaced apartfrom each other and not to overlap each other. That is, the uppersurfaces of the openings O1 in FIG. 3A may be covered with patterns(132P of FIG. 1) of the second reflective layer 132. The reason andadvantage that the upper surfaces of the first openings O1 in FIG. 3A donot overlap the lower surfaces of the second openings O2 may bedescribed as follows.

When a semiconductor layer to be grown is a group III nitride-basedsemiconductor, the semiconductor layer may be grown by the ELO methodusing a distributed Bragg reflector as a reflective layer. Here, in thecase that a single reflective layer is used, a substrate or a bufferlayer disposed on the substrate may be exposed by openings anddislocations may be propagated in a light-emitting layer through theopenings. In addition, in the case that the substrate is not alight-transmissive substrate such as sapphire but a light-absorbingsubstrate, light emitted from the light-emitting layer through theopenings may be absorbed to the light-absorbing substrate and thus lightextraction efficiency may be reduced.

Accordingly, when the second openings O2 are formed on the firstreflective layer 130 including the first openings O1 of FIG. 1 such thatthe lower surfaces of the second openings O2 are spaced apart from theupper surfaces of the first openings O1 of FIG. 1 in order for the uppersurfaces of the first openings O1 of FIG. 1 to be masked by the patterns(132P of FIG. 1) of the second reflective layer 132, the dislocationspropagated through the first openings O1 of FIG. 1 may be blocked by thepatterns (132P of FIG. 1) of the second reflective layer 132. Inaddition, since light emitted from the light-emitting layer is reflectedby the patterns 130P of the first reflective layer 130 on the lowersurfaces of the second openings O2, the light may not be absorbed by thesubstrate 110. Thus, a semiconductor light-emitting device havingreduced dislocations and high light extraction efficiency may be formed.

Here, areas of the upper surfaces of the first openings O1 in FIG. 3Amay be greater than areas of the upper surfaces of the second openingsO2. When the areas of the upper surfaces of the first openings O1 inFIG. 3A are large, a growth rate of the first conductivity-typesemiconductor layer 140 by the ELO may be increased.

Next, referring to FIG. 8, after forming the second reflective layer 132and the mask layer 145 on the substrate 110, the buffer layer 120, thefirst reflective layer 130 including the patterns 130P, and the firstconductivity-type semiconductor layer 140, nanocores 152 formed of afirst conductivity-type semiconductor material and extending from thesecond openings O2 of FIG. 7 and may be formed. The firstconductivity-type semiconductor material may be the same as the firstconductivity-type semiconductor layer 140 in FIG. 1.

The nanocores 152 may have a variety of shapes. For example, thenanocores 152 may have a pillar shape whose width decreases toward alower portion thereof or a pillar shape whose width increases toward alower portion thereof.

Next, referring to FIG. 9, after the mask layer 145 and the nanocores152 illustrated in FIG. 8 are formed on the substrate 110, the bufferlayer 120, the first reflective layer 130 including the patterns 130P,and the second reflective layer 132, the mask layer 145 illustrated inFIG. 8 may be removed. By removing the mask layer 145 illustrated inFIG. 8, patterns 132P of the second reflective layer 132 may be exposed.

In some embodiments, after the mask layer 145 illustrated in FIG. 8 isremoved, a heat treatment process may be further carried out to changecrystal planes of the nanocores 152 into stable planes advantageous forcrystal growth, such as a semipolar crystal plane or a nonpolar crystalplane.

Next, referring to FIG. 10, after forming the substrate 110, the bufferlayer 120, the first reflective layer 130 including the patterns 130P,the second reflective layer 132 including the patterns 132P, and thenanocores 152, active layers 154 and second conductivity-typesemiconductor layers 156 may be sequentially formed on surfaces of theplurality of nanocores 152. Thus, the light-emitting nanostructures 150may have a core-shell structure configured with the nanocores 152, theactive layers 154, and the second conductivity-type semiconductor layers156.

Next, referring to FIG. 11, after forming the substrate 110, the bufferlayer 120, the first reflective layer 130 including the patterns 130P,the second reflective layer 132 including the patterns 132P, thenanocores 152, the active layers 154, and the second conductivity-typesemiconductor layers 156, a contact electrode layer 160 may be formed onthe second conductivity-type semiconductor layers 156 and the patterns132P of the second reflective layer 132. The contact electrode layer 160may be formed by, for example, chemical vapor deposition (CVD) orphysical vapor deposition (PVD).

FIG. 12 is a plan view illustrating the semiconductor light-emittingdevice 100 illustrated in FIG. 1.

Referring to FIG. 12, light-emitting nanostructures 150 may be disposedon the patterns 130P of the first reflective layer 130 of FIG. 1. Thepatterns 130P of the first reflective layer 130 of FIG. 1 and thelight-emitting nanostructures 150 may have a cylindrical shape. That is,the first reflective layer of FIG. 12 may be the same as the firstreflective layer 130 illustrated in FIG. 3B.

A contact electrode layer 160 may be formed on the light-emittingnanostructures 150 and the second reflective layer 132 of FIG. 1. Asecond electrode 170 may be disposed on a portion of the contactelectrode layer 160 where the light-emitting nanostructures 150 are notformed. One side of the semiconductor light-emitting device 100 of FIG.1 may be removed to expose a portion of the upper surface of the firstconductivity-type semiconductor layer 140 of FIG. 1, and a firstelectrode 172 may be disposed on the exposed portion of the uppersurface of the first conductivity-type semiconductor layer 140 of FIG.1.

FIG. 13 is a plan view illustrating a semiconductor light-emittingdevice according to an exemplary embodiment of the present disclosure.

Referring to FIG. 13, a first reflective layer may be the same as thefirst reflective layer 130 a of FIG. 3C. The first reflective layer 130a of FIG. 3C may include the pillar-shaped first openings O1 a extendingperpendicular to a substrate. Upper surfaces of the first openings O1 amay be disposed to be spaced apart from lower surfaces of light-emittingnanostructures 150 a.

A contact electrode layer 160 a may be formed on the light-emittingnanostructures 150 a and the second reflective layer. A second electrode170 a may be formed on a portion of the contact electrode layer 160 awhere the light-emitting nanostructures 150 a are not formed. One sideof the semiconductor light-emitting device 100 of FIG. 1 may be removedto expose a portion of the upper surface of the first conductivity-typesemiconductor layer 140 of FIG. 1, and a first electrode 172 a may bedisposed on the exposed portion of the upper surface of the firstconductivity-type semiconductor layer 140 of FIG. 1.

FIG. 14 is a schematic cross-sectional view illustrating a semiconductorlight-emitting device according to an exemplary embodiment of thepresent disclosure. Hereinafter, duplicated descriptions of FIG. 1 willbe omitted.

Referring to FIG. 14, a semiconductor light-emitting device 200 mayinclude a substrate 210, a buffer layer 220 disposed on the substrate210, a first reflective layer 230 disposed on buffer layer 220 andincluding first openings O3 and patterns 230P, a first conductivity-typesemiconductor lower layer 240 grown in and extending from the firstopenings O3 and connected on the first reflective layer 230, a secondreflective layer 232 disposed on the first conductivity-typesemiconductor lower layer 240 and including patterns 232P and secondopenings O4 having lower surfaces disposed to be spaced apart from uppersurfaces of the first openings O3, a light-emitting structure 250including a first conductivity-type semiconductor upper layer 252 grownin and extending from the second openings O4 and connected on the secondreflective layer 232, an active layer 254 and a second conductivity-typesemiconductor layer 256 sequentially stacked on the firstconductivity-type semiconductor upper layer 252, a second electrode 270disposed on the second conductivity-type semiconductor layers 256, and afirst electrode 272 disposed on an exposed portion of an upper surfaceof the first conductivity-type semiconductor lower layer 240. Theexposed portion of the upper surface of the first conductivity-typesemiconductor lower layer 240 may be formed by removing one side of thesemiconductor light-emitting device 200.

FIG. 15A is an exploded perspective view illustrating only a substrate210 a, a buffer layer 220 a, a first reflective layer 230 a, and asecond reflective layer 232 a of a semiconductor light-emitting deviceaccording to an exemplary embodiment of the present disclosure, whereinthe first and second reflective layers 230 a and 232 a are illustratedas being separated from each other. In FIG. 15A, the firstconductivity-type semiconductor lower layer 240 a is illustrated asbeing separated into two parts, one of which includes the firstreflective layer 230 a.

Referring to FIG. 15A, the buffer layer 220 a may be disposed on thesubstrate 210 a, and the first reflective layer 230 a may be disposed onthe buffer layer 220 a. Here, patterns 230Pa of the patterned firstreflective layer 230 a may be a pillar-shaped distributed Braggreflector extending perpendicular to the substrate 210 a. In addition,the patterns 230Pa may have a polygonal pillar shape having variouscross-sectional shapes. The first conductivity-type semiconductor lowerlayer 240 a surrounding the patterns 230Pa may be disposed between thepatterns 230Pa.

The second reflective layer 232 a may be disposed on the firstreflective layer 230 a. The second reflective layer 232 a may includesecond openings O4 a having pillar shapes extending perpendicular to thesubstrate 210 a. A first conductivity-type semiconductor upper layer maybe grown in and extend from the second openings O4 a. The secondopenings O4 a may have polygonal pillar shapes having variouscross-sectional shapes. The second reflective layer 232 a may be adistributed Bragg reflector. Lower surfaces of the second openings O4 amay be disposed on upper surfaces of the first conductivity-typesemiconductor lower layer 240 a, and each second opening O4 a mayoverlap with a respective pattern 230Pa of the first reflective layer230 a. That is, the lower surfaces of the second openings O4 a may bedisposed to be spaced apart from a portion of the firstconductivity-type semiconductor lower layer 240 a that surrounds lateralsurfaces of the first reflective layer 230 a.

FIG. 15B is an exploded perspective view illustrating only a substrate210 b, a buffer layer 220 b, a first reflective layer 230 b, and asecond reflective layer 232 b of a semiconductor light-emitting deviceaccording to an exemplary embodiment of the present disclosure, whereinthe first and second reflective layers 230 b and 232 b are illustratedas being separated from each other. In FIG. 15B, the firstconductivity-type semiconductor lower layer 240 b is illustrated asbeing separated into two parts, one of which includes the firstreflective layer 230 b.

Referring to FIG. 15B, the buffer layer 220 b may be disposed on thesubstrate 210 b, and the first reflective layer 230 b may be disposed onthe buffer layer 220 b. The first reflective layer 230 b may includefirst openings having a pillar shapes extending perpendicular to thesubstrate 210 b. The first conductivity-type semiconductor lower layer240 b may be grown in and extend from the first openings. The firstopenings may have a polygonal pillar shapes having variouscross-sectional shapes. The first reflective layer 230 b may be adistributed Bragg reflector.

The second reflective layer 232 b may be disposed on the firstreflective layer 230 b. Here, patterns 232Pb of the patterned secondreflective layer 232 b may be a pillar-shaped distributed Braggreflector extending perpendicular to the substrate 210 b. In addition,the patterns 232Pb may have a polygonal pillar shape having variouscross-sectional shapes. Second openings O4 b surrounding the patterns232Pb may be disposed between the patterns 232Pb. A firstconductivity-type semiconductor upper layer may be grown in and extendfrom the second openings O4 b.

Lower surfaces of the second openings O4 b may be disposed to be spacedapart from upper surfaces of the first openings of the first reflectivelayer 230 b. That is, each pattern 232Pb of the second reflective layer232Pb may overlap with a respective first opening of the firstreflective layer 230 b.

FIG. 15C is an exploded perspective view illustrating only a substrate210 c, a buffer layer 220 c, a first reflective layer 230 c, and asecond reflective layer 232 c of a semiconductor light-emitting deviceaccording to an exemplary embodiment of the present disclosure, whereinthe first and second reflective layers 230 c and 232 c are illustratedas being separated from each other. In FIG. 15C, the firstconductivity-type semiconductor lower layer 240 c is illustrated asbeing separated into two parts, one of which includes the firstreflective layer 230 c.

Referring to FIG. 15C, the buffer layer 220 c may be disposed on thesubstrate 210 c, and the first reflective layer 230 c may be disposed onthe buffer layer 220 c. Here, patterns 230Pc of the patterned secondreflective layer 230 c may be a pillar-shaped distributed Braggreflector extending perpendicular to the substrate 210 c. The patterns230Pc may have a polygonal pillar shape having various cross-sectionalshapes. The first conductivity-type semiconductor lower layer 240 csurrounding the patterns 230Pc may be disposed between the patterns230Pc.

The second reflective layer 232 c may be disposed on the firstreflective layer 230 c. The second reflective layer 232 c may includepillar-shaped second openings O4 c having lateral surfaces angled withrespect to an upper surface of the substrate 210 c. Although it isillustrated that upper surfaces of the second openings O4 c have asmaller cross-sectional area than lower surfaces of the second openingsO4 c in FIG. 15C, the lower surfaces of the second openings O4 c mayhave a smaller cross-sectional area than the upper surfaces of thesecond openings O4 c, on the contrary. Light emitted from alight-emitting layer may be subjected to scattered reflection on thesecond reflective layer 232 c due to the angled lateral surfaces of thesecond openings O4 c, and thus the light extraction efficiency may beimproved. A first conductivity-type semiconductor upper layer may begrown in and extend from the second openings O4 c. The second openingsO4 c may have a polygonal pillar shape having various cross-sectionalshapes. The second reflective layer 232 c may be a distributed Braggreflector. Lower surfaces of the second openings O4 c may be disposed onupper surfaces of the patterns 230Pc of the first reflective layer 230c. That is, the lower surfaces of the second openings O4 c may bedisposed to be spaced apart from the upper surfaces of the patterns230Pc of the first reflective layer 230 c.

FIG. 15D is an exploded perspective view illustrating only a substrate210 d, a buffer layer 220 d, a first reflective layer 230 d, and asecond reflective layer 232 d of a semiconductor light-emitting deviceaccording to an exemplary embodiment of the present disclosure, whereinthe first and second reflective layers 230 d and 232 d are illustratedas being separated from each other. In FIG. 15D, the firstconductivity-type semiconductor lower layer 240 d is illustrated asbeing separated into two parts, one of which includes the firstreflective layer 230 d.

Referring to FIG. 15D, the buffer layer 220 d may be disposed on thesubstrate 210 d, and the first reflective layer 230 d may be disposed onthe buffer layer 220 d. The first reflective layer 230 d may includefirst openings having a pillar shape extending perpendicular to thesubstrate 210 d. The first conductivity-type semiconductor lower layer240 d may be grown in and extend from the first openings. The firstopenings may have a polygonal pillar shape having variouscross-sectional shapes. The first reflective layer 230 d may be adistributed Bragg reflector.

The second reflective layer 232 d may be disposed on the firstreflective layer 230 d. Here, patterns 232Pd of the patterned secondreflective layer 232 d may be a pillar-shaped distributed Braggreflector having lateral surfaces angled with respect to an uppersurface of the substrate 210 d. Although it is illustrated that uppersurfaces of the patterns 232Pd of the second reflective layer 232 d havea smaller cross-sectional area than lower surfaces of the patterns 232Pdof the second reflective layer 232 d in FIG. 15D, the lower surfaces ofthe patterns 232Pd of the second reflective layer 232 d may have asmaller cross-sectional area than the upper surfaces of the patterns232Pd of the second reflective layer 232 d, on the contrary. Lightemitted from a light-emitting layer may be subjected to scatteredreflection on the second reflective layer 232 d due to the angledlateral surfaces of the patterns 232Pd, and thus the light extractionefficiency may be improved. In addition, the patterns 232Pd may have apolygonal pillar shape having various cross-sectional shapes. Secondopenings O4 b surrounding the patterns 232Pd may be disposed between thepatterns 232Pd. A first conductivity-type semiconductor upper layer maybe grown in and extend from the second openings O4 d.

Lower surfaces of the second openings O4 d may be disposed to be spacedapart from upper surfaces of the first openings of the first reflectivelayer 230 d. That is, each pattern 232Pd of the second reflective layer232 d may overlap with a respective first opening of the firstreflective layer 230 d.

FIG. 15E is an exploded perspective view illustrating only a substrate210 e, a buffer layer 220 e, a first reflective layer 230 e, and asecond reflective layer 232 e of a semiconductor light-emitting deviceaccording to an exemplary embodiment of the present disclosure, whereinthe first and second reflective layers 230 e and 232 e are illustratedas being separated from each other. In FIG. 15E, the firstconductivity-type semiconductor lower layer 240 e is illustrated asbeing separated into two parts, one of which includes the firstreflective layer 230 e.

Referring to FIG. 15E, the first reflective layer 230 e may be disposedon the substrate 210 e and the buffer layer 220 e. The first reflectivelayer 230 e may include trench-shaped first openings O3 e extending inone direction and bar-shaped patterns 230Pe disposed alternately withthe first openings O3 e. The first conductivity-type semiconductor lowerlayer 240 e grown in and extending from the first openings O3 e of thefirst reflective layer 230 e and connected on the first reflective layer230 e. The second reflective layer 232 e including trench-shaped secondopenings O4 e extending in one direction and bar-shaped patterns 232Pedisposed alternately with the second openings O4 e may be formed on thefirst conductivity-type semiconductor lower layer 240 e. In addition,lower surfaces of the second openings O4 e may be disposed on thepatterns 230Pe of the first reflective layer 230 e.

Although not shown in the drawings, the patterns 232Pe of the secondreflective layer 232 e may have a bar shape having lateral surfacesangled with respect to an upper surface of the substrate 210 e. Lightemitted from a light-emitting layer may be subjected to scatteredreflection on the second reflective layer 232 e due to the angledlateral surfaces of the patterns 232Pe, and thus the light extractionefficiency may be improved.

FIG. 16 is a schematic cross-sectional view of a semiconductorlight-emitting device according to an exemplary embodiment of thepresent disclosure. Hereinafter, duplicated descriptions of FIG. 1 willbe omitted.

Referring to FIG. 16, a semiconductor light-emitting device 300 mayinclude a substrate 310, a buffer layer 320 disposed on the substrate310, a first reflective layer 330 disposed on the buffer layer 320 andincluding first openings and patterns 330P, a first conductivity-typesemiconductor lower layer 340 grown in and extending from the firstopenings and connected on the first reflective layer 330, a secondreflective layer 332 disposed on the first conductivity-typesemiconductor lower layer 340 and including second openings and patterns332P having lower surfaces disposed to be spaced apart from uppersurfaces of the first openings, a light-emitting structure 350 includinga first conductivity-type semiconductor upper layer 352 grown in andextending from the second openings and connected on the secondreflective layer 332, an active layer 354, and a secondconductivity-type semiconductor layer 356 sequentially disposed on thefirst conductivity-type semiconductor upper layer 352, a secondelectrode 370 disposed on the second conductivity-type semiconductorlayer 356, and a first electrode 372 disposed on a lower surface of thesubstrate 310. Here, the substrate 310 may be formed of a conductivematerial, for example, a silicon substrate.

FIG. 17 is a schematic cross-sectional view of a semiconductorlight-emitting device according to an exemplary embodiment of thepresent disclosure. Hereinafter, duplicated descriptions of FIG. 1 willbe omitted.

Referring to FIG. 17, a semiconductor light-emitting device 400 mayinclude a substrate 410, a buffer layer 420 disposed on the substrate410, a first reflective layer 430 disposed on the buffer layer 420 andincluding first openings and patterns 430P, a first conductivity-typesemiconductor lower layer 440 grown in and extending from the firstopenings and connected on the first reflective layer 430, a secondreflective layer 432 disposed on the first conductivity-typesemiconductor lower layer 440 and including second openings and patterns432P having lower surfaces disposed to be spaced apart from uppersurfaces of the first openings, a light-emitting structure 450 includinga first conductivity-type semiconductor upper layer 452 grown in andextending from the second openings and connected on the secondreflective layer 432, an active layer 454, and a secondconductivity-type semiconductor layer 456 sequentially disposed on thefirst conductivity-type semiconductor upper layer 452, a secondelectrode 470 disposed on a lower surface of the substrate 410 andelectrically connected to the second conductivity-type semiconductorlayer 456 through a through-hole 480 filled with a conductive materialand surrounded by an insulating layer 482, and a first electrode 472disposed on the lower surface of the substrate 410. Here, the substrate410 may be formed of a conductive material, for example, a siliconsubstrate.

Table 1 lists computer-simulated light extraction efficiencies ofExample 1, Comparative Example 1, and Comparative Example 2. Here,Example 1 is the exemplary embodiment of the present disclosureillustrated in FIG. 14, Comparative Example 1 has the same structure asExample 1 except that only one reflective layer is formed, andComparative Example 2 has the same structure as Example 1 except thatonly one reflective layer is formed and the reflective layer does notinclude openings.

TABLE 1 Comparative Comparative Example 1 Example 1 Example 2 LightExtraction 67.7 21.6 23.1 Efficiency (%)

From the result listed in Table 1, when two reflective layers havingopenings positioned not to overlap each other are formed according tothe embodiments of the present disclosure, light extraction efficiencymay be improved by reducing dislocations propagated to a light-emittinglayer and reducing light absorbed by a substrate, compared to a case inthat the reflective layer does not include openings, or a case in thateven if openings exist, only one reflective layer is formed.

FIG. 18 illustrates a semiconductor light-emitting device package 1000in which the semiconductor light-emitting device 100 illustrated in FIG.1 is mounted.

Referring to FIG. 18, the semiconductor light-emitting device 100 may bemounted on a lead frame 1003, and electrodes may be electricallyconnected to the lead frame 1003 by wires W1 and W2, respectively. Asnecessary, the semiconductor light-emitting device 100 may be mounted onan area, for example, on a package body 1002, other than the lead frame1003. In addition, the package body 1002 may have a cup shape in orderto improve light reflection efficiency, and an encapsulating structure1004 formed of a light-transmitting material may be formed in such areflection cup in order to encapsulate the semiconductor light-emittingdevice 100.

FIG. 19 illustrates a semiconductor light-emitting device package 2000in which the semiconductor light-emitting device 100 illustrated in FIG.1 is mounted.

Referring to FIG. 19, the semiconductor light-emitting device 100 may bemounted on a mounting board 2010 to be electrically connected to themounting board 2010 through wires W3 and W4.

The mounting board 2010 may include a board body 2002, an upperelectrode 2003, and a lower electrode 2004, and a through electrode 2001connecting the upper electrode 2003 to the lower electrode 2004. Themounting board 2010 may be provided as a substrate, such as a PCB, anMCPCB, an MPCB, and an FPCB. The structure of the mounting board 2010may be embodied in various forms.

An encapsulant 2005 may be formed to have a dome-shaped lens structurehaving a convex upper surface. In some embodiments, the encapsulant 2005may have a convex or concave lens structure to adjust an orientationangle of light emitted through the upper surface of the encapsulant2005. As necessary, a wavelength conversion material, such as a phosphoror a quantum dot, may be disposed on a surface of the encapsulant 2005or the semiconductor light-emitting material.

FIGS. 20 and 21 illustrate examples of a backlight unit including asemiconductor light-emitting device according to an exemplary embodimentof the present disclosure.

Referring to FIG. 20, a backlight unit 3000 may include a light source3001 mounted on a substrate 3002, and one or more optical sheets 3003disposed on the light source 3001. The light source 3001 may include theabove-described nanostructure semiconductor light-emitting device or apackage including the nanostructure semiconductor light-emitting device.

The light source 3001 in the backlight unit 3000 illustrated in FIG. 20emits light toward a top surface where a liquid crystal display (LCD) isdisposed. On the contrary, in another backlight unit 4000 illustrated inFIG. 21, a light source 4001 mounted on a substrate 4002 emits light ina lateral direction, and the emitted light may be incident to a lightguide plate 4003 and converted to the form of surface light. Lightpassing through the light guide plate 4003 is emitted upwardly, and areflective layer 4004 may be disposed on a bottom surface of the lightguide plate 4003 to improve light extraction efficiency.

FIG. 22 is an exploded perspective view illustrating an illuminationapparatus including a nanostructure semiconductor light-emitting deviceaccording to an exemplary embodiment of the present disclosure.

The illumination apparatus 5000 of FIG. 22 is illustrated as a bulb-typelamp as an example, and includes a light-emitting module 5003, a drivingunit 5008, and an external connection portion 5010.

In addition, external structures, such as external and internal housings5006 and 5009 and a cover 5007, may be further included. Thelight-emitting module 5003 may include a light source 5001, that is, theabove-described nanostructure semiconductor light-emitting device or apackage including the nanostructure semiconductor light-emitting device,and a circuit board 5002 with the light source 5001 mounted thereon. Forexample, first and second electrodes of the semiconductor light-emittingdevice may be electrically connected to an electrode pattern of thecircuit board 5002. In this exemplary embodiment, a single light source5001 is mounted on the circuit board 5002, but a plurality of lightsources 5001 may be mounted as needed.

The external housing 5006 may function as a heat dissipation unit, andinclude a heat dissipation plate 5004 in direct contact with thelight-emitting module 5003 to enhance a heat dissipation effect, and aheat radiation fin 5005 surrounding side surfaces of the illuminationapparatus 5000. The cover 5007 may be installed on the light-emittingmodule 5003, and have a convex lens shape. The driving unit 5008 may beinstalled in the internal housing 5009 and connected to the externalconnection portion 5010, such as a socket structure, to receive powerfrom an external power source.

In addition, the driving unit 5008 may function to convert the powerinto an appropriate current source capable of driving the light source5001 of the light-emitting module 5003. For example, the driving unit5008 may be configured as an AC-DC converter, a rectifying circuitcomponent, or the like.

FIG. 23 illustrates an example in which a semiconductor light-emittingdevice according to an exemplary embodiment of the present disclosure isapplied to a headlamp.

Referring to FIG. 23, a headlamp 6000 used as a vehicle lamp, or thelike, may include a light source 6001, a reflective unit 6005, and alens cover unit 6004. The lens cover unit 6004 may include a hollow-typeguide 6003 and a lens 6002. The light source 6001 may include theabove-described semiconductor light-emitting device or a packageincluding the semiconductor light-emitting device.

The headlamp 6000 may further include a heat dissipation unit 6012dissipating heat generated by the light source 6001 outwardly. In orderto effectively dissipate heat, the heat dissipation unit 6012 mayinclude a heat sink 6010 and a cooling fan 6011. In addition, theheadlamp 6000 may further include a housing 6009 fixedly supporting theheat dissipation unit 6012 and the reflective unit 6005. The housing6009 may have a central hole 6008 formed in one surface thereof, inwhich the heat dissipation unit 6012 is coupledly installed.

The housing 6009 may include a front hole 6007 formed on the othersurface integrally connected to the one surface and bent in a rightangle direction. The front hole 6007 may fix the reflective unit 6005 tobe disposed over the light source 6001. Accordingly, a front side of thehousing 6009 may be open by the reflective unit 6005. The reflectiveunit 6005 is fixed to the housing 6009 such that the opened front sidecorresponds to the front hole 6007, and thereby light reflected by thereflective unit 6005 may pass through the front hole 6007 to be emittedoutwardly.

As set forth above, a semiconductor light-emitting device according tothe exemplary embodiments of the present disclosure have advantages ofpreventing dislocations from being propagated to a light-emitting layerand preventing light emitted from the light-emitting layer from beingabsorbed by a substrate.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinvention as defined by the appended claims.

What is claimed is:
 1. A semiconductor light-emitting device,comprising: a substrate; a first reflective layer disposed on thesubstrate and including first openings; a first conductivity-typesemiconductor lower layer grown in and extending from the first openingsand connected on the first reflective layer; a second reflective layerdisposed on the first conductivity-type semiconductor lower layer andincluding second openings having lower surfaces disposed to be spacedapart from upper surfaces of the first openings; a firstconductivity-type semiconductor upper layer grown in and extending fromthe second openings and connected on the second reflective layer; and anactive layer and a second conductivity-type semiconductor layersequentially disposed on the first conductivity-type semiconductor upperlayer, wherein: the second openings have a pillar shape having a lateralsurface angled with respect to the upper surface of the substrate, andthe second reflective layer includes a distributed Bragg reflectorsurrounding the second openings.